Computer Software

Resilient modulus by indirect tensile test

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Rak 3 (Kelompok Proceeding)

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Ketersediaan

Informasi Detail

Judul Seri

Proceedings of the Fourth International Symposium Held by RILEM (The International Union of Testing and Research Laboratories for Materials and Structures)

No. Panggil

625.06(063) Sai r

Penerbit

London And New York : Chapman and Hall., 1990

Deskripsi Fisik

pp.590-606

Bahasa

English

ISBN/ISSN

0-412-39260-7

Klasifikasi

625.06(063)

Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

First edition

Subjek

RESILIENT MODULUS TESTING

Info Detail Spesifik

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Pernyataan Tanggungjawab

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Versi lain/terkait

Lampiran Berkas

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