Gaya APA
Said, S.F.. (1990).
Resilient modulus by indirect tensile test (First edition).
London And New York:
Chapman and Hall.
Gaya Chicago
Said, S.F..
Resilient modulus by indirect tensile test.
First edition
London And New York:
Chapman and Hall,
1990.
Computer Software.
Gaya MLA
Said, S.F..
Resilient modulus by indirect tensile test.
First edition
London And New York:
Chapman and Hall,
1990.
Computer Software.
Gaya Turabian
Said, S.F..
Resilient modulus by indirect tensile test.
First edition
London And New York:
Chapman and Hall,
1990.
Computer Software.