Gaya APA
Titi, H. (2003).
Characterization of resilient modulus of coarse grained materials using the intrution technology .
:
ASTM.
Gaya Chicago
Titi, H.
Characterization of resilient modulus of coarse grained materials using the intrution technology.
:
ASTM,
2003.
Art Original.
Gaya MLA
Titi, H.
Characterization of resilient modulus of coarse grained materials using the intrution technology.
:
ASTM,
2003.
Art Original.
Gaya Turabian
Titi, H.
Characterization of resilient modulus of coarse grained materials using the intrution technology.
:
ASTM,
2003.
Art Original.